LEC-2050
- Description
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Description
Overview
The LEC-2050 is designed for flexible deployment in any scenario. Its robust fanless design and extended temperature range make the LEC-2050 an ideal solution for a wide range of industrial and commercial applications.
The onboard Intel® Atom™ embedded processor provides unsurpassed performance with very low heat generation and minimal cooling requirements, resulting in improved stability and longevity, and providing a higher return on investment.
To provide even more flexibility, Lanner’s engineers have built the case of tough aluminum with heat dispersing fins to whisk away heat from the processor and allow the system to operate in harsh environments – from -10°C to 55°C.
Specifications
| Platform | |
| CPU | Intel® Atom™ N270 1.6GHz |
| Chipset | Intel® 945GSE + ICH7M |
| Memory Technology | 512MB DDR2 on board, DDR2 SODIMM x1 |
| Memory Capacity | Up to 2GB |
| Storage | |
| IDE storage | CF socket Type I/II x1 |
| SATA storage | 2.5” HDD/SSD drive bay x 1 |
| I/O | |
| Ethernet controller | Realtek RTL8111 x2 |
| Graphic controller | Intel® GMA950 |
| Audio controller | Realtek ALC888 |
| Default LAN | GbE RJ45 x2 |
| Management ports | DB9 x4 for RS232/422/485 x2 and RS232 x2 |
| Audio ports | Phone-Jack x2 for Mic-in and Line-out |
| USB 2.0 | 4 x Type A |
| Power and Mechanical | |
| Power input | None |
| Others | External: power-on button, 2 x SMA antenna holes. Internal: PS/2 keyboard & mouse, +5 V DC output |
| OS and Certifications | |
| Operating System | Linux , XPE/WES2009, XP Pro FES, WS7E, WS7P, Win 7 Pro FES |
| Physical and Environmental | |
| Operating temperature | 5ºC to 45ºC |
| Operating temperature (industrial components) |
-10ºC to 55ºC |
| Dimensions (W x H x D) | 268 mm x 43 mm x 144 mm (10.45″ x 1.68″ x 5.62″) |
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