TANK-820-H61

Mô tả

Features
	♦ 2nd/3rd Generation Intel® Core™ low power desktop processors (Max TDP. 65W) ♦ On-board 2GB DDR3 memory and one DDR3 SO-DIMM slot (system max. 10GB) ♦ Dual wide range DC power support (9 V~24 V DC)

Specifications

Color	Black C + Silver
Dimensions (WxDxH)	133 mm x 269 mm x 208 mm
System Fan	Fanless
Chassis Construction	Extruded aluminum alloys
Resolution	VGA: Up to 2048 x 1536@75Hz DVI-I: Up to 1920 x 1080@60Hz
CPU	Intel® Core™ i5-2xxT (above 2.7 GHz) Intel® Core™ i3-2xxT (above 2.5 GHz) Intel® Pentium® G6xxT (above 2.2 GHz)
Chipset	Intel® H61
System Memory	On-board DDR3 2 GB memory 1 x 204-pin DDR3 SO-DIMM (system max: 10 GB)
Hard Drive	1 x 2.5” SATA 3Gb/s HDD/SSD bay
CompactFlash®	1 x CF Type II
USB 3.0	2
USB 2.0	4
Ethernet	2 x RJ-45 PCIe GbE by Realtek 8111E
RS-232	4 x DB-9 (two with isolation)
RS-422/485	2 x RJ-45
Digital I/O	8-bit digital I/O, 4-bit input/4-bit output
Audio	1 x Line-out, 1 x Mic-in
Display	1 x VGA, 1 x DVI-I
PCI	2P1E: 2 x PCI, 1P2E: 1 x PCI
PCIe	2P1E: One PCIe x 8 (physical PCIe x 16 slot) 1P2E: One PCIe x 1 (physical x 4 slot), One PCIe x 8 (physical x 16 slot)
Power Input	Terminal Block: 9 V~24 V DC DC Jack: 9 V~24 V DC
Power Consumption	19 V@3.5 A (Intel® Core™ i3-2100 with 6 GB DDR3 memory) w/o add-on card
Mounting	Wall mount
Operating Temperature	-20°C ~ 60°C with air flow (SSD), 5% ~ 95%, non-condensing
Operating Shock	Half-sine wave shock 5G, 11ms, 3 shocks per axis
Operation Vibration	MIL-STD-810F 514.5C-2 (with SSD)
Weight (Net / Gross)	4.2 kg/6.3 kg
Safety / EMC	CE/FCC
Supported OS	Microsoft® Windows® Embedded Standard 7 E Microsoft® Windows® XP Embedded

Ordering Information

Part No.	Description
TANK-820-H61-P/2G/2P1E-R22	Fanless Extend temperature embedded system with One PCIe x8 and two PCI expansion, Pentium Dual Core G6xxT CPU (Above 2.2 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C
TANK-820-H61-P/2G/1P2E-R22	Fanless Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Pentium Dual Core G6xxT CPU (Above 2.2 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C
TANK-820-H61-i3/2G/2P1E-R22	Fanless Extend temperature embedded system with One PCIe x8 and two PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C
TANK-820-H61-i3/2G/1P2E-R22	Fanless Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C
TANK-820-H61-i5/2G/2P1E-R22	Fanless Extend temperature embedded system with One PCIe x8 and two PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C
TANK-820-H61-i5/2G/1P2E-R22	Fanless Extend temperature embedded system with One PCIe x1 and one PCIe x 8 and one PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7 GHz), TDP 35W, Dual 9 V-24 V DC-IN, 2GB DDR3 Memory on-board, -20°C ~ 60°C

Packing List

1 * Utility CD: Drivers and user manual	1 * One Key Recovery CD (P/N:7B000-000724-RS)
1 * Power Adapter: FSP120-ABBN2, 90 V ~ 264 V AC input, 120 W, 19 V DC output, ErP (P/N:63040-010120-210-RS)	1 * Power Cord: 1500 mm, European Standard (P/N:32702-000401-100-RS)
2 * Mounting Bracket: Wall mount bracket, Mount bracket, NCT processing formation, RoHS (P/N:41020-0366E4-00-RS)	4 * Mounting Bracket Screws (P/N:44033-040062-RS)
4 * HDD Screw: M030*05 for securing HDD (P/N:44043-030051-RS)	4 * Rubber Foot Pad Screws: M4*6 for securing rubber foot pads (P/N:44033-040061-RS)
2 * RJ-45 to DB-9 COM Port Cable: Round cable, RS-232/422/485, RS-232 cable, 2, 300mm, 26AWG, (A)D-SUB 9P male, (B)RJ-45 8P8C+SHELL, RoHS (P/N:32005-000200-200-RS)	1 * Pluggable DC-in Terminal Block: 3-pin terminal block (P/N:33502-000007-RS)
4 * Foot Pads: BOTTOM PAD, NF-002, 11.5D8.7D7.4H, black rubber, RoHS (P/N:46007-001500-RS)	4 * FAN screws (P/N:44003-030151-RS)

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